Based on the standard for testing in surface mounting, an area of critical deformation is determined when mounting electronic modules in a housing (box). A methodology for testing and determining the deformation has been chosen, as well as tools for conducting experimental measurements. The results of practical measurements of deformations during assembly of electronic modules in a housing are presented. A conclusion is made on the basis of the obtained results with conclusions regarding the admissibility of the process according to the standard.
Valentin Tsenev
Valentin Videkov
Nadejda Spasova
College of Energy and Electronics, Technical University of Sofia
Faculty of Electronic Engineering and Technologies Technical university of Sofia
Bulgaria
e-mail: vtsenev@tu-sofia.bg
Abstract:
Key words:
Assembly
Standard
Measurement
Testing
Deformations