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2024 International Conference on Information Technologies

Measurement of PCB Deformation during Functional Testing of Electronic Modules

Valentin Tsenev
Valentin Videkov
Nadejda Spasova
College of Energy and Electronics, Technical University of Sofia
Faculty of Electronic Engineering and Technologies Technical university of Sofia
Bulgaria
Abstract:

With an intelligent measuring system, the PCBA (Printed circuit board assembly) deformation was prepared and measured during a functional test of a product. An area of critical deformation is defined based on the standards for testing in surface mounting. The used intelligent measuring system and its setting are described. The results of practical measurements of deformations during functional testing of a specific product are presented. A conclusion is made on the basis of the obtained results with conclusions regarding the admissibility of the process according to the standard.

Key words:
Measuring system
Measurement
Deformation
Testing