Valentin Tsenev
Radostin Rusev
Valentin Videkov
Miroslav Slavchev
Technical University of Sofia
Bulgaria
e-mail: vtsenev@tu-sofia.bg
Abstract:
The article describes the study and the results of soldering with mixed two solder pastes - standard and low temperature in a combined footprint. The combined footprint was made by jet printer with a SAC305 and 58Bi42Sn pastes. The experiments were carried out with a different ratio between the standard and low-temperature pastes. It was measured whether changing the amount of bismuth in the solder paste changed the amount of voids in the component solders. Standard electronic components were examined and analysed to obtain an objective statistical analysis.
Key words:
solder
combined footprint
bismuth
void
statistics